Product Category: High Temperature Bond

Nichrome V Series – HFN

Max Temp: 1600°F (871°C). Wire resistance strain gages constructed of Nichrome V alloy wire.

Platinum-Tungsten – HFP

Max Temp: 1900°F (1038°C). Wire resistance strain gages constructed of platinum/tungsten alloy. Features: Excellent high temperature oxidation resistance, and low, stable temperature coefficients of resistance.

Moleculoy Series – HFM

Max Temp: 1600°F (871°C). Wire resistance strain gages constructed of Moleculoy®, a non-magnetic 75/20 nickel chromium alloy modified with cobalt and aluminum.

Karma Series – HFK

Max Temp: 650°F (350°C). Wire resistance strain gages constructed of K alloy (Evanohm), and factory heat treated to provide temperature compensation of 6ppm/°F (10.8ppm/°C) on standard materials.